The reflow profile creation will be gated by the component with the lowest maximum case temperature. Step 2: Bill of materials (BOM) analysis is critical. Step 1: Introduction of a lead-free BGA on a tin/lead assembly has been identified and communicated. The flowchart in Figure 1 provides a guideline for "leaded" hybrid assemblies using a five-step process approach.įigure 1. A traditional tin/lead reflow profile typically specifies a maximum reflow temperature of 210° to 217☌. Hybrid Assembly ProcessA lead-free plastic BGA with SAC 305 alloy requires collapse of the balls or spheres at approximately 217° to 220☌ to make a reliable solder joint. The term can also relate to a lead-free assembly that contains leaded components. The term hybrid within this article refers to a printed circuit assembly that uses tin/lead solder and contains lead-free plastic ball grid arrays. This transition has caused a new classification for printed circuit assemblies, politely defined as hybrid. Component manufacturers have obsoleted tin/lead or non-RoHS-complaint part numbers, with only RoHS-compliant offerings left. ![]() Three years have passed since the European Union (EU) adopted the Restriction of Hazardous Substances (RoHS) regulation, and the transition to RoHS compliance has impacted the entire electronics industry.įor companies using non-RoHS processes and continuing to specify leaded alloys, supply chain management has been, and continues to be, challenging. By Scott Mazur, Benchmark Electronics Inc.
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